conga-HPC/mIQ-X

COM-HPC Mini Size High-Performance Module | based on Qualcomm® Dragonwing™ IQ-X | an exciting, high-performance alternative to Intel that combines multi-OS flexibility with Android, Windows, and Linux

Features:

  • First high-performance ARM on COM-HPC Mini
  • Up to 12 Qualcomm® Oryon CPU cores
  • Qualcomm® Hexagon NPU with 45 TOPS
  • High performance Qualcomm® Adreno GPU
  • PCI Express Gen 4 | USB 4
  • Industrial Temperature Range -40°C to +85°C

Ordering information:

conga-HPC/mIQ-X7-64G UFS128 | 053100
conga-HPC/mIQ-X7-32G UFS128 | 053101
conga-HPC/mIQ-X7-16G UFS128 | 053102
conga-HPC/mIQ-X5-32G UFS128 | 053106
conga-HPC/mIQ-X5-16G UFS128 | 053107

Key Features

Technical Data

Manufacturer
congatec
Technology
Product Series
Computer-on-Module
Product Category
Special SOM
Size Diagonal
CPU Type
CPU
Resolution (max)
Brightness [cd/m2]
Viewing angle U/D/L/R
Controller
Temperature Range Top
Temperature Range Tst
Interface
Power Supply
Inputs
Outputs
Format
Dimensions
Touch
Touch Points
Glass Strength
Memory
up to 64GB soldered down LPDDR5x

Downloads

Below are the downloads available for this product. If you require any further information please contact us.
DATASHEET
DRAWING
MANUAL
EOL File

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