NDiS V1100
Fanless Embedded Box PC Powered by 11th Gen Intel® Core™ Tiger Lake Processor
Features:
- 11th Gen Intel® Core™ (Tiger Lake UP3) processor SoC
- Dual non-ECC DDR4 3200 SO-DIMM, support up to 32Gb
- 4 x HDMI 2.0, support 4K@60Hz
- Dual LAN ports and 3 x USB 3.0 ports
- Onboard M.2 2280 Key M with PCIe x4 signal for storage modules
- Onboard mini-PCIe for optional Wi-Fi or LTE modules
- Fanless design
Ordering Information:
NDiS V1100-i3 | P/N: 10W00110000X0
NDiS V1100-i5 | P/N: 10W00110001X0
Key Features
Technical Data
Manufacturer
Nexcom
Technology
Product Series
Product Category
Size Diagonal
CPU Type
CPU
Resolution (max)
Brightness [cd/m2]
Viewing angle U/D/L/R
Controller
Temperature Range Top
Temperature Range Tst
Interface
Power Supply
Inputs
Outputs
Format
Dimensions
Touch
Touch Points
Glass Strength
Memory
Max. 64GB DDR4 SO-DIMM
Downloads
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